It is also used for thermal management applications due to its high thermal conductivity. 1 1 ratio general properties 100 solids two component silver filled epoxy with a soft smooth thixotropic becoming less viscous when stirred or shaken consistency designed specifically for chip bonding in microelectronic and optoelectronic applications. It can also be used as a solder replacement for bonding heat sensitive electronic components or for making conductive connections.
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