Silicone Thermally Conductive Encapsulant

Good thermal conductivity 0 7 w m k low viscosity 4000cps.

Silicone thermally conductive encapsulant.

Home thermally conductive silcool tia208r thermally conductive silicone encapsulant. Lord cooltherm sc 6703 thermally conductive silicone encapsulant is a two component system designed to provide thermal conductivity for encapsulating densely packed power units. Tia208r has the unique benefit of providing primerless adhesion when cured at both elevated heat or at room temperature to not only metallic substrates but to also. Primerless adhesion to metals and plastics.

They also provide protection from harsh environments vibration and thermal shock. Fast cure 2 component room temperature curable thermally conductive potting material. Thermally conductive encapsulant designed for fast fill rates and reworkability with moderate thermal conductivity gray 3 200 addition cure. Two part 1 1 1 hr 40 24 hrs 30 min 60 c 1 58 45 1 8 85 24 ul 94 v 0 dowsil cn 8760 thermally conductive encapsulant even higher flow version of dowsil cn 8760 g encapsulant dark gray 2 700.

Thermally conductive silicones from dow come in a wide range of viscosities cure speeds and delivery systems to meet the growing need for improved thermal management in electronics designs for virtually every industry. Unable to complete action likely due to connectivity to dow s back end service. Thermally conductive silicone encapsulant. Silco therm thermally conductive silicone encapsulants can be used in potting applications to dissipate heat away from a component to a suitable heat sink.

The practice of using silicone in encapsulating and potting electronic components is a well established process designed to protect delicate circuitry.